RK3568 LVDS eDP MIPI HDMI display board for Saudi Buyers: Rockchip RK3568 Board Export by Wanlin Chi

Executive Summary - Rockchip RK3568 Board Export for Global B2B Buyers

Executive summary - 10 buyer-relevant points:

• Flagship model WF-RK3568-TC810 Rockchip RK3568 Thin Client Cloud Terminal Board, Rockchip RK3568 quad-core 64-bit SoC, 22 nm process, 1 TOPS NPU
• CPU / GPU 4x ARM Cortex-A55 up to 2.0 GHz, 64-bit / Mali-G52 2EE GPU, OpenGL ES 3.2
• Video decode Hardware 4K@60fps H.265 / VP9 decode, 1080p@60fps encoding
• Memory and storage 4GB LPDDR4 + 16GB eMMC (2GB-8GB LPDDR4 / 16GB-128GB eMMC configurable)
• OS Android 11 / Linux (Debian, Yocto, Ubuntu) dual-OS images
• Display HDMI 2.0 + LVDS + eDP + MIPI-DSI, dual-display independent output
• 8 board families: TV box, digital signage, commercial display, touch all-in-one, SBC, IoT gateway, industrial control, thin client
• Target buyer: IT distributors, VDI solution providers, school districts and government IT departments
• Contact: Androidsbc@163.com / +8613261677119 / www.androidsbc.com

Global Rockchip RK3568 Board Market Overview and 2026 Buyer Demand

Confirm the applicable requirements and current documents for the destination and complete equipment configuration.

Rockchip RK3568 Product Engineering and Hardware Platform Architecture

Three sub-modules define the engineering depth:

• SoC and compute module - Rockchip RK3568 quad-core 64-bit SoC, 22 nm process, 1 TOPS NPU. 4x ARM Cortex-A55 up to 2.0 GHz, 64-bit handles sustained media and UI workloads in fanless enclosures.
• Display and video module - Hardware 4K@60fps H.265 / VP9 decode, 1080p@60fps encoding. HDMI 2.0 + LVDS + eDP + MIPI-DSI, dual-display independent output covers panel-direct and HDMI deployments with dual-display independent output options.
• Software and management module - Android 11 / Linux (Debian, Yocto, Ubuntu) dual-OS images. OTA upgrade, boot logo customization, pre-installed app support and launcher customization enable the app ecosystem and remote management for fleets.

Featured Model - WF-RK3568-TC810 Rockchip RK3568 Thin Client Cloud Terminal Board Technical Signature

The unique technical signature of WF-RK3568-TC810 on this configuration is documented below. Every parameter is engineering-verified by our Shenzhen lab and cross-checked against the display panel specifications of mainstream LCD vendors and the safety limits of IEC / UL 62368-1.

Published configuration reference — confirm the exact model, revision and current documents.

Specification	Value
soc_platform	Rockchip RK3568 quad-core 64-bit SoC, 22 nm process, 1 TOPS NPU
cpu_core	4x ARM Cortex-A55 up to 2.0 GHz, 64-bit
gpu_3d	Mali-G52 2EE GPU, OpenGL ES 3.2
video_decode	Hardware 4K@60fps H.265 / VP9 decode, 1080p@60fps encoding
memory_storage	4GB LPDDR4 + 16GB eMMC (2GB-8GB LPDDR4 / 16GB-128GB eMMC configurable)
display_out	HDMI 2.0 + LVDS + eDP + MIPI-DSI, dual-display independent output
touch_screen	Optional touch for all-in-one terminal builds
interfaces_io	CAN bus, RS485 x2, USB 3.0 x2, PCIe 2.1 x1 lane, TF card slot
networking	Dual Gigabit Ethernet + WiFi 6 + Bluetooth 5.0, Mini PCIe 4G/5G expansion
power_input	DC 12V input with hardware watchdog and RTC
operating_temp	-40 deg C to +85 deg C industrial grade
board_dimension	95 x 75 mm SOM core board with B2B connector; custom carrier on request
additional_features	Industrial edge computing profile, wide-temperature trim, long-lifecycle supply commitment

Rockchip RK3568 Application Scenarios across Thin Client Sites

AndroidSBC Rockchip RK3568 Competitive Advantages for Cross-Border Buyers

The WF-RK3568-TC810 and the broader AndroidSBC Rockchip RK3568 portfolio deliver eight distinct advantages for cross-border B2B buyers sourcing Android boards directly from Chinese manufacturers:

1. Platform engineering - 4x ARM Cortex-A55 up to 2.0 GHz, 64-bit with Mali-G52 2EE GPU, OpenGL ES 3.2, engineered in Shenzhen rather than rebadged from a broker.
2. Hardware 4K@60fps H.265 / VP9 decode - Hardware 4K@60fps H.265 / VP9 decode, 1080p@60fps encoding, at a cost point set for volume deployments.
3. Full display interface coverage - HDMI 2.0 + LVDS + eDP + MIPI-DSI, dual-display independent output, supporting panels from 7 to 86 inches with factory panel-config and backlight driver onboard.
4. Dual-OS flexibility - Android 11 / Linux (Debian, Yocto, Ubuntu) dual-OS images with Ubuntu / Debian / Yocto Linux images serves both app-driven and Linux-BSP projects from one board.
5. Custom memory/storage - 2GB-8GB LPDDR4 / 16GB-128GB eMMC configurable, matching image size and workload to deployment need.
6. ODM depth - carrier board redesign, custom I/O, custom enclosure, AOSP build and Linux BSP porting from one factory.
7. Continuous-duty reliability - hardware watchdog, RTC, scheduled power on/off, auto-reboot and wide-temperature trim for commercial and industrial duty.

Rockchip RK3568 Board Economics, MOQ, Lead Time and Logistics Math

For a first-time buyer ordering 1,000 pieces of the WF-RK3568-TC810 Rockchip RK3568 Thin Client Cloud Terminal Board, the economics stack is:

Rockchip RK3568 Board Export FAQ - OEM, ODM, MOQ, Lead Time, Partnership

Which Rockchip RK3568 board should I source for my application?

Answer: Eight selection rules for cross-border buyers:

• (1) OTT / IPTV / streaming boxes: WF-RK3568-TV110 with the media pipeline and IR wake-up.
• (2) Digital signage and advertising machines: WF-RK3568-DS210 with dual display and CMS agents.
• (3) Commercial displays, information publishing and kiosk back ends: WF-RK3568-CD310 with LVDS / eDP panel support.
• (4) Touch all-in-ones, smart screens and smart mirrors: WF-RK3568-SD410 with MIPI-DSI + 10-point touch.
• (5) Maker SBCs, Linux hosts and prototyping: WF-RK3568-SB510 with GPIO header and dual-OS images.
• (6) Smart home hubs, IoT gateways and building automation: WF-RK3568-IG610 with RS485 / CAN and radio options.
• Confirm warranty coverage, included items, availability and delivery terms in the configuration-specific written quotation.
• (8) Thin clients, VDI terminals, education labs and NAS: WF-RK3568-TC810 with cloud desktop agents.

Can the same board run Android and Linux, and how does dual-OS work?

Answer: Yes. Every Rockchip RK3568 family ships Android images alongside Linux support (Ubuntu, Debian and Yocto-based builds). Dual-OS means we can flash Android to the onboard eMMC and provide a Linux image for TF-card boot, or ship a dual-partition image that selects the OS at power-up. For industrial and gateway projects we pre-load a Linux BSP with device tree, drivers and SDK; for TV, signage and display projects the default image is Android with the launcher, CMS agent or desktop client you specify.

What customization and partnership options does Wanlin offer?

Answer: Customization scope:

1. (1) Branding - custom PCB silk-screen, private-label logo on board and enclosure, custom SKU and packaging.
2. (2) Firmware - boot logo, boot animation, pre-installed apps, custom launcher, locked-down kiosk builds.
3. (3) Hardware - carrier board redesign, custom I/O, memory and storage combos (2GB-8GB LPDDR4 / 16GB-128GB eMMC configurable), WiFi/BT module selection, 4G/5G radio options.
4. (4) Software - AOSP build service, Linux BSP porting, SDK module development, OTA server setup.
5. (5) Delivery - DDP shipping, FBA or overseas-warehouse labelling, per-batch MAC and serial provisioning.

Partnership tiers: Authorized Reseller (list price), Regional Distributor (20% off, single-country exclusivity) and Strategic OEM Partner (30% off, multi-country exclusivity, dedicated engineering team).

Conclusion - How to Start Your Rockchip RK3568 Board Sourcing Today

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Article signature:

soc_platform: Rockchip RK3568 quad-core 64-bit SoC, 22 nm process, 1 TOPS NPU
cpu_core: 4x ARM Cortex-A55 up to 2.0 GHz, 64-bit
gpu_3d: Mali-G52 2EE GPU, OpenGL ES 3.2
video_decode: Hardware 4K@60fps H.265 / VP9 decode, 1080p@60fps encoding
memory_storage: 4GB LPDDR4 + 16GB eMMC (2GB-8GB LPDDR4 / 16GB-128GB eMMC configurable)
os_android: Android 11 / Linux (Debian, Yocto, Ubuntu) dual-OS images
display_out: HDMI 2.0 + LVDS + eDP + MIPI-DSI, dual-display independent output
touch_screen: Optional touch for all-in-one terminal builds
interfaces_io: CAN bus, RS485 x2, USB 3.0 x2, PCIe 2.1 x1 lane, TF card slot
networking: Dual Gigabit Ethernet + WiFi 6 + Bluetooth 5.0, Mini PCIe 4G/5G expansion
power_input: DC 12V input with hardware watchdog and RTC
operating_temp: -40 deg C to +85 deg C industrial grade
board_dimension: 95 x 75 mm SOM core board with B2B connector; custom carrier on request
certifications: CE / FCC / RoHS / REACH / UKCA
additional_features: Industrial edge computing profile, wide-temperature trim, long-lifecycle supply commitment

• Author: Wanlin Group AndroidSBC Export Engineering Team
• Published: 2026-09-10 10:29
• Shenzhen HQ: Wanlin Group, Building B, Building 1, Beisida Medical Device Building, 28 Nantong Avenue, Baolong Community, Baolong Sub-district, Longgang District, Shenzhen, Guangdong, China


• Contact: Email Androidsbc@163.com | Phone +8613261677119 | Website https://www.androidsbc.com